发明名称 CASE MOLDED CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case molded capacitor used on hybrid automobiles or the like with an enhanced reliability.SOLUTION: The case molded capacitor has bus bars 2 and 3 which are constituted including: an electrode connection part 2a connected to an electrode; an external connection terminal 2b connected to the external; and a link portion 2c linking the electrode connection part 2a and the external connection terminal 2b. A part of the link portion of at least one bus bar 2(3) is a formed in a comb-teeth portion 2 g (3 g) in contact with a molding resin, and in which neighboring comb-teeth are arranged not to overlap with each other in a side view. This constitution prevents a local stress from occurring in the molding resin even when the molding resin is subjected to a thermal shock; to thereby prevent the molding resin from clacking due to a thermal shock. As a result, the reliability of the case molded capacitor is enhanced.
申请公布号 JP2013211324(A) 申请公布日期 2013.10.10
申请号 JP20120079152 申请日期 2012.03.30
申请人 PANASONIC CORP 发明人 HOSOKAWA SATOSHI;NAKATSUBO KAZUHIRO;MIURA TOSHIHISA
分类号 H01G4/228;H01G2/10;H01G4/18;H01G4/38 主分类号 H01G4/228
代理机构 代理人
主权项
地址
您可能感兴趣的专利