发明名称 |
INTERCHIP COMMUNICATION USING A DIELECTRIC WAVEGUIDE |
摘要 |
An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
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申请公布号 |
US2013265732(A1) |
申请公布日期 |
2013.10.10 |
申请号 |
US201213439557 |
申请日期 |
2012.04.04 |
申请人 |
HERBSOMMER JUAN A.;PAYNE ROBERT F.;CORSI MARCO;HAROUN BAHER S.;ALI HASSAN;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HERBSOMMER JUAN A.;PAYNE ROBERT F.;CORSI MARCO;HAROUN BAHER S.;ALI HASSAN |
分类号 |
H05K1/11;H05K1/18 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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