| 发明名称 |
PLASMA PROCESS, FILM DEPOSITION METHOD AND SYSTEM USING ROTARY CHUCK |
| 摘要 |
A chuck and a wafer supported thereon are rotated during a plasma process or a film deposition process to reduce thickness non-uniformity of a film processed or deposited on the wafer.
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| 申请公布号 |
US2013264308(A1) |
申请公布日期 |
2013.10.10 |
| 申请号 |
US201213439609 |
申请日期 |
2012.04.04 |
| 申请人 |
YANG YU-LUNG;XIAO YING;LIN CHIN-HSIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YANG YU-LUNG;XIAO YING;LIN CHIN-HSIANG |
| 分类号 |
B05C11/02;C03C25/68;C23C14/54;H05H1/24 |
主分类号 |
B05C11/02 |
| 代理机构 |
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