CONICAL SPONGE BRUSH FOR CLEANING SEMICONDUCTOR WAFERS

摘要

A cleaning device for cleaning a substrate (104) is provided. In one aspect, the cleaning device includes a brush (110) including a first end (124), a second end(126) opposed to the first end (124), an outer surface (114), and a hollow bore (112) defined in the brush (110) about a central axis of the brush. The brush (110) defines a first cross- sectional area near the first end (124) and a second cross-sectional area near the second end (126). Both the first and second cross- sectional areas are generally perpendicular to the central axis (al) and the second cross-sectional area is greater than the first cross- sectional area.