摘要 |
<p>Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate.</p> |
申请人 |
APPLIED MATERIALS, INC.;WANG, QUNHUA;CHOI, SOO YOUNG;TINER, ROBIN L.;WHITE, JOHN M.;FURUTA, GAKU;PARK, BEOM SOO |
发明人 |
WANG, QUNHUA;CHOI, SOO YOUNG;TINER, ROBIN L.;WHITE, JOHN M.;FURUTA, GAKU;PARK, BEOM SOO |