发明名称
摘要 PROBLEM TO BE SOLVED: To provide a plated copper wire that is excellent in heat resistance and shows resistance to corrosion, and a method for manufacturing the same. SOLUTION: The plated copper wire has a plurality of plating layers on a surface of a Cu substrate, in which a surface part thereof is composed of a Sn-based plating layer 4 made of Sn or a Sn alloy and having an average thickness of 0.05-1.5 &mu;m, and a Sn-Ag coating layer 5 formed on the Sn-based plating layer 4, and having a hardness of 10-20 Hv and an average thickness of 0.05-0.5 &mu;m. The Sn-Ag coating layer 5 contains Sn particles 11 and Ag<SB>3</SB>Sn particles 12 having average particle sizes of 1-10 &mu;m and 10-100 nm, respectively. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP5313773(B2) 申请公布日期 2013.10.09
申请号 JP20090134780 申请日期 2009.06.04
申请人 发明人
分类号 C25D5/12;C25D3/56;C25D7/00;H01R13/03 主分类号 C25D5/12
代理机构 代理人
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