发明名称 |
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET |
摘要 |
The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).) |
申请公布号 |
EP2647685(A1) |
申请公布日期 |
2013.10.09 |
申请号 |
EP20110845999 |
申请日期 |
2011.11.28 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
SHIMADA, AKIRA;SHINBA, YOICHI;NONAKA, TOSHIHISA |
分类号 |
C09J179/08;C08G73/10;C08G77/14;C08K3/28;C08L79/08;C09J7/00;C09J11/04;C09J163/00;C09J183/10;H01L23/00;H01L23/36 |
主分类号 |
C09J179/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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