| 摘要 |
<p>The present invention refers to a method to separate an adhesive material from a releasable substrate attached to the adhesive material by fixing the releasable substrate with respect to the adhesive material, providing an impact to the releasable substrate and/or the adhesive material to at least reduce adhesion between the releasable substrate and the adhesive material in a predetermined area, and peeling off the releasable substrate from the adhesive material. Furthermore, the invention is directed to a respective release apparatus for separating a releasable substrate from an adhesive material, comprising fixing means for fixing the adhesive material and fixing means for fixing the releasable substrate with respect to the adhesive material and for peeling off the releasable substrate from the adhesive material. The release apparatus further comprising an impact unit providing a force impact to the releasable substrate and/or the adhesive material to at least reduce adhesion between the releasable substrate and the adhesive material in a predetermined area, prior to peeling off the releasable substrate from the adhesive material.</p> |
