| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device for, especially, assuring packed amount of solder into a through-hole and surely securing a lead inserted into the through-hole, relating to a soldering method for reflow soldering a surface mounting component and a lead component together. SOLUTION: A metal mask 81 includes an opening 81b where a shielding body 81a is formed at a position corresponding to a through-hole formed on a printed wiring board. An insert hole forming means 82 forms an insert hole which is the hole for inserting a lead of a component having the lead at one end of the through-hole by soldering a cream solder printed through the opening 81b. A lead inserting means 83 inserts a lead toward the insert hole from other end when the cream solder is printed from the other end of the through-hole. COPYRIGHT: (C)2010,JPO&INPIT |
