| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of forming a rectangular or nearly rectangular profile even after the formed pattern is baked. <P>SOLUTION: The positive photosensitive resin composition contains: (component A) a polymer having a monomer unit (a1) having a residue comprising a carboxyl group or a phenolic hydroxyl group protected with an acid decomposable group, a monomer unit (a2) having an epoxy group and/or an oxetanyl group, and a monomer unit (a3) having a structure selected from a group consisting of an amino group, amide group, imide group, sulfonimide group, sulfonamide group, imino group, urethane bond and ureido bond; (component B) a photoacid generator; and (component C) a solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
