发明名称 |
VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE |
摘要 |
A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate. |
申请公布号 |
EP2400540(A4) |
申请公布日期 |
2013.10.09 |
申请号 |
EP20100743499 |
申请日期 |
2010.01.27 |
申请人 |
NEC CORPORATION |
发明人 |
YAMAZAKI, TAKAO;SANO, MASAHIKO;KURASHINA, SEIJI |
分类号 |
H01L23/02;G01J1/02;G01J5/02;G01J5/04;H01L23/057;H01L23/10;H01L23/26 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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