| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition of an adhesive for sealing semiconductor devices, wherein the adhesive exhibits high insulation reliability by allowing the adhesive to have effects of suppressing occurrence of voids in connecting a semiconductor chip and a substrate at a high temperature of 200°C or above and suppressing formation of electrically conductive substances by oxidation of tin plated on wiring lines of the substrate. <P>SOLUTION: The composition of the adhesive for sealing semiconductor devices includes (a) an epoxy resin, (b) a curing agent, and (c) an oxidation inhibitor. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
