| 摘要 |
<p>A wire (200) is provided that is adapted for sawing semiconductor material (102; 104; 106; 108), wherein the wire includes a non-circular cross section. Furthermore, a wire guide (112, 114, 116, 118) adapted for guiding the wire (200) for sawing semiconductor material (102, 104, 106, 108) as described is provided. The wire guide comprising at least one groove that includes a rectangular or trapezoidal cross-section.</p> |
