INGOT MOUNTING ADHESIVE COMPOSITIONS

摘要

PURPOSE: An ingot mounting adhesive composition is provided to be used as an adhesive composition for processing a wafer and to offer a pot life and a normal-temperature adhesive strength proper for the process of operation. CONSTITUTION: An ingot mounting adhesive composition comprises, with respect to the whole composition, 40 to 70 wt% of an epoxy compound or a (meth)acrylate compound or both; 15 to 35 wt% of a curing agent or an initiator; and 2 to 30 wt% of a moisture-absorbing agent. The moisture-absorbing agent is magnesium sulfate or magnesium sulfate or calcium chloride. The composition has a normal-temperature adhesive strength of 5 to 25 kg/die, an adhesive strength after absorbing moisture of 1.0 to 10 kg/die, and a moisture-absorbing rate of 0.5 to 3.0%.