发明名称 PROCESS KIT DESIGN TO REDUCE PARTICLE GENERATION
摘要 A method for making a process kit and a process kit design which has reduced particle generation during substrate processing are provided. The internal surface of the process kit design are textured by coating its surface with a first material layer having a smaller RMS surface roughness measurement and arc spraying with a second material layer or additional material layers having a larger RMS value. The first material layer can be coated by bead blasting, plating, arc spraying, thermal spraying, or other processes. In addition, the invention also provides selective coating of internal surface of the process kit with a protective layer and arc spraying the surface pf the protective layer with another material layer, which may be of the same material as the material of the internal surface of the process kit.
申请公布号 KR101314747(B1) 申请公布日期 2013.10.08
申请号 KR20060058318 申请日期 2006.06.27
申请人 发明人
分类号 H01L21/02;H01L21/203;H01L21/205;H01L21/3065 主分类号 H01L21/02
代理机构 代理人
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