发明名称 Filled polyamide molding materials showing a reduced water absorption
摘要 Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
申请公布号 US8552103(B2) 申请公布日期 2013.10.08
申请号 US20100914143 申请日期 2010.10.28
申请人 REXIN ORNULF;AEPLI ETIENNE;EMS-CHEMIE AG 发明人 REXIN ORNULF;AEPLI ETIENNE
分类号 C08K3/04;C08K3/10;C08K3/22;C08K3/34;C08L77/06 主分类号 C08K3/04
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