| 摘要 |
The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 mum of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.
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