| 摘要 |
<p>PURPOSE: A copper alloy plate for an electrical and electronic component is provided to use Cu-Ni-Si-based copper alloy, thereby having the excellent bending workability and internal stress mitigation performance. CONSTITUTION: A copper alloy plate for an electrical and electronic component consists of a copper alloy including 1.5 to 4.0 mass% of nickel (Ni), silicon (Si) with 4.0 to 5.0 of the mass ratio of Ni/Si, and 0.01 to 1.3 mass% of tin (Sn), and the remainder copper (Cu) and other inevitable impurities, is satisfied with 5 to 20μm of average grain size and 2σ< 10μm of the standard deviation of the average grain size, and has at least 20% of the ratio of the number of the particle with a diameter 90 to 300 nm among the disperse particle which has a diameter of 30 to 300 nm and is observed on the cross-section configured in the direction parallel to the vertical and rolling directions of the plate surface.</p> |
