| 发明名称 |
Wiring material, method of manufacturing wiring, and nano-particle dispersion |
| 摘要 |
A wiring material contains copper, nitrogen, and a dopant which is more readily oxidized than copper in an Ellingham diagram, the dopant being added to the wiring material at a rate of not less than 0.5 at. % and not more than 10 at. %.
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| 申请公布号 |
US8551369(B2) |
申请公布日期 |
2013.10.08 |
| 申请号 |
US201113250142 |
申请日期 |
2011.09.30 |
| 申请人 |
FUJII TAKAMICHI;FUJIFILM CORPORATION |
发明人 |
FUJII TAKAMICHI |
| 分类号 |
H01B1/12;B05D5/12;H01B1/02 |
主分类号 |
H01B1/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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