发明名称 Power semiconductor device
摘要 A semiconductor layer has a first layer of first conductive type, a second layer of second conductive type, and a third layer. The third layer has a first region of first conductive type, and a second region of second conductive type. A second electrode is in contact with each of the first and second regions. A trench is formed on the semiconductor layer at a surface opposite to its surface facing a first electrode. A gate electrode is embedded in the trench with a gate insulating film interposed therebetween. The gate electrode includes a first portion projecting into the first layer through the first region and the second layer, a second portion projecting into the first layer through the second region and the second layer. The second portion projects into the first layer deeper than a depth in which the first portion projects into the first layer.
申请公布号 US8552468(B2) 申请公布日期 2013.10.08
申请号 US20100724987 申请日期 2010.03.16
申请人 NARAZAKI ATSUSHI;MITSUBISHI ELECTRIC CORPORATION 发明人 NARAZAKI ATSUSHI
分类号 H01L29/74 主分类号 H01L29/74
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