LIGHT EMITTING DIODE(LED) PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to prevent the deformation and degradation of the light emitting diode package by including a metal lead frame with a metal housing. CONSTITUTION: A metal housing (100) includes a receiving unit. The receiving unit receives a light emitting diode chip. A lead part (150) is integrated with the metal housing. An insulation member (170) surrounds the receiving unit of the metal housing. The insulation member insulates the lead part from the metal housing.