发明名称 Circuit board with higher current
摘要 A circuit board includes a plurality of conductive layers, at least one group of vias, a number of second vias, at least one power supply element, and at least one electronic element. Each conductive layer includes a conductive portion. Both the first vias and the second vias are defined through the conductive layers and electrically connected each conductive layers. The at least one group of first vias surrounds the at least one power supply element. The second vias are arranged along the side of the conductive portion, and positioned between the power supply element and the electronic element. Current from a power supply element flows to the inner conductive layers through the group of surrounding first vias. Current transmission on each conductive layer continuously flows to another conductive layer having a lower resistance through the second vias during transmission.
申请公布号 US8553426(B2) 申请公布日期 2013.10.08
申请号 US201113304415 申请日期 2011.11.25
申请人 HUANG TSUNG-SHENG;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HUANG TSUNG-SHENG
分类号 H05K7/00 主分类号 H05K7/00
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