PURPOSE: A temperature prediction method of a device improves the performance of the device by maintaining the maximum allowable power for a CPU for a long time. CONSTITUTION: A temperature prediction circuit corresponding to a device including a semiconductor chip is provided (S1). A current-voltage correlation of the temperature prediction circuit is constructed (S2). The temperature for power applied to the device is predicted by using the current-voltage correlation of the temperature prediction circuit (S3). [Reference numerals] (AA) Start; (BB) End; (S1) Temperature prediction circuit corresponding to a device including a semiconductor chip is provided; (S2) Current-voltage correlation of the temperature prediction circuit is constructed; (S3) Temperature for power applied to the device is predicted by using the current-voltage correlation of the temperature prediction circuit
