| 摘要 |
PURPOSE: A semiconductor substrate, a semiconductor device, and a manufacturing method of the semiconductor device suppress the deformation of a wire by matching the direction in which an encapsulating sheet is extended and the direction in which the wire is extended. CONSTITUTION: A circuit board (4) receives power from the outside. Multiple semiconductor devices (5) are mounted on the circuit board. Multiple wires (6) are provided corresponding to each of the semiconductor devices. One end and the other end of the wire are electrically connected to the semiconductor device and the circuit board, respectively. The wires are extended along the radial direction of a virtual circle having a central point on the circuit board. An encapsulating layer (3) collectively encapsulates the semiconductor devices. [Reference numerals] (AA,CC) Transverse direction; (BB) Longitudinal direction; (DD) Up; (EE) Down |
