发明名称 Method for fabricating silicon dioxide film using TMS and ozone
摘要 A method for manufacturing a SiO2 film is provided to improve step coverage and good gap-fill capability and have a less carbon content. A method for manufacturing a SiO2 film comprises the following steps of: performing a thermal chemical vapor deposition(CVD) with respect to a SiO2 film by using trimethylsilane(TMS) and ozone(O3), and processing plasma with respect to the SiO2 film vapor-deposited by the thermal CVD using gas which includes oxygen or hydrogen.
申请公布号 KR101316745(B1) 申请公布日期 2013.10.08
申请号 KR20070032655 申请日期 2007.04.03
申请人 发明人
分类号 H01L21/205;H01L21/76 主分类号 H01L21/205
代理机构 代理人
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