发明名称 Light-emitting diode packaging structure of low angular correlated color temperature deviation
摘要 A light-emitting diode (LED) packaging structure having low angular correlated color temperature deviation includes: a substrate, a LED chip, a phosphor body, and a transparent lens. The LED chip is disposed on the substrate, and the phosphor body includes a hemisphere body and an extension part extended from the bottom of the hemisphere body. The phosphor body is disposed on the substrate and covers the LED chip. Besides, the transparent lens is disposed outside the phosphor body to cover the phosphor body to increase light extraction efficiency. With the implementation of the present invention, the setup of the extension part makes a longer vertical distance between the LED chip and the top of the phosphor body, so that the light in the normal direction of the LED chip can have a longer optical length, thereby to reduce the angular correlated color temperature deviation.
申请公布号 US8552456(B1) 申请公布日期 2013.10.08
申请号 US201213491255 申请日期 2012.06.07
申请人 SUN CHING-CHERNG;CHEN CHING-YI;CHIU CHIH-YU;NATIONAL CENTRAL UNIVERSITY 发明人 SUN CHING-CHERNG;CHEN CHING-YI;CHIU CHIH-YU
分类号 H01L33/00 主分类号 H01L33/00
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