LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME DIODE

摘要

PURPOSE: An LED package and a manufacturing method thereof appropriately combine light from an LED chip and fluorescent substances and provide various color changes by containing one or more fluorescent substances in a first molding part. CONSTITUTION: A PCB (10) is formed in a first direction lengthwise. A light emitting diode (20) is mounted on the PCB in the first direction. A first molding part (42) includes at least one fluorescent substance. A second molding part (44) is formed along the first direction of the PCB. The second molding part includes a reflective surface (442) reflecting light from the light emitting diode to the inner direction.