发明名称 |
Method for hot embossing at least one conductive track onto a substrate |
摘要 |
In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.
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申请公布号 |
US8549743(B2) |
申请公布日期 |
2013.10.08 |
申请号 |
US20080733487 |
申请日期 |
2008.07.08 |
申请人 |
EHRENPFORDT RICARDO;MAY JOHANNA;ROBERT BOSCH GMBH |
发明人 |
EHRENPFORDT RICARDO;MAY JOHANNA |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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