| 摘要 |
PROBLEM TO BE SOLVED: To realize a module which achieves stable joint strength between an electrode of a circuit element and a copper plate.SOLUTION: A module 100 includes: a copper plate 10; a circuit element 30; and an alloy layer 20 that joins the copper plate 10 to an electrode 32 of the circuit element 30. The alloy layer 20 includes a first portion 22, a second portion 26, and a third portion 24. The first portion 22 is positioned on the copper plate 10 side and is made of a first type alloy composed of tin and copper. The second portion 26 is positioned on the electrode 32 side of the circuit element 30 and is made of a second type alloy including at least one kind of metal, which is selected from gold, nickel, and silver, and tin. The third portion 24 is positioned between the first portion 22 and the second portion 26, and the first type alloy and the second type alloy are mixed therein. |
