| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a crystal oscillator capable of manufacturing a high accuracy crystal oscillator, while facilitating process management of an etching process.SOLUTION: In the method of manufacturing a crystal oscillator by etching a wafer composed of a crystal material, a thin part is provided on the wafer surface, a crystal oscillator is formed from the wafer by etching while etching the thin part simultaneously, the time required for etching the thin part and penetrating the wafer is measured, etching rate in the thickness direction of the wafer is calculated from that time and the thickness of the thin part, and the etching time for obtaining the crystal oscillator is determined by converting the etching rate in the width direction of the wafer from the etching rate in te thickness direction. |
