NON-CONTACT ELEMENT

摘要

PURPOSE: A non-contact element is provided to reduce production costs by using cheap epoxy which protects an element and is filled in a lower element mold. CONSTITUTION: A lower cover for covering an element mold is mounted (S51). A sensing element is mounted through the opening part of an upper element mold. A wire bonding process is performed. A cover is bonded to the sensing element by filling the opening with epoxy (S60). The lead support is removed from the lead frame (S70). A lead is bent (S80). [Reference numerals] (S10) Lead frame processing step; (S20) Lower device molding step; (S30) Device mold equipping step; (S40) Device mounting and wire bonding step; (S50) Epoxy filling step; (S51) Lower cover mounting step; (S60) Sensing device mounting step; (S70) Lead support removal step; (S80) Lead bending step