发明名称 METHOD FOR CUTTING TEMPERED GLASS PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method for suppressing the generation of cutting failure in cutting a tempered glass plate with laser light irradiation.SOLUTION: There is provided a method for cutting a tempered glass plate 10 composed of a front surface layer and a back surface layer having residual compression stress, and an intermediate layer formed between the front surface layer and the back surface layer and having residual tensile stress, by irradiating the tempered glass plate 10 with laser light. The method includes a step of scanning the laser light along a planned cutting line 35 of the tempered glass plate 10 to remove unnecessary materials on the planned cutting line 35, and a step of scanning the laser light along the planned cutting line 35 while extending an initial crack and cut the tempered glass plate 10. The radiation energy of the laser light per unit irradiation area is made to be smaller in the step of removing unnecessary materials than in the step of cutting the tempered glass plate 10.
申请公布号 JP2013203630(A) 申请公布日期 2013.10.07
申请号 JP20120076841 申请日期 2012.03.29
申请人 ASAHI GLASS CO LTD 发明人 SAITO ISAO;IWASAKI TATSUYA
分类号 C03B33/09;B23K26/00;B23K26/38;B23K26/40;C03C23/00;G02F1/13 主分类号 C03B33/09
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