| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method which can remove foreign materials by discharging a processing liquid to which ultrasonic vibration is applied to a substrate and using substrate vibration generated by the processing liquid, and suppress damage on the substrate by cavitation.SOLUTION: A substrate processing device includes a first nozzle 10, a second nozzle 20, and a third nozzle 30. The first nozzle 10 discharges a first processing liquid 15 to a first discharge position P1 of a substrate 9. The second nozzle 20 discharges a second processing liquid 25 to which an ultrasonic wave is applied to a second discharge position P2 of the substrate 9. The third nozzle 30 sprays gas 35 on P3 between the first discharge position P1 and the second discharge position P2. When removing foreign materials, the substrate 9 is vibrated by the second processing liquid 25 and a foreign material 9P isolated from the surface of the substrate 9 by the vibration is removed by washing it away with the first processing liquid 15. At the same time, spreading of the second processing liquid 25 is suppressed by spraying of the gas 35 and damage on the substrate 9 by cavitation is suppressed. |
