| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting method which allows for mounting of a component on a substrate while suppressing oxidation of the electrode, and the like.SOLUTION: The component mounting method includes a first step for exposing a substrate 20, on which components 22, 23 are arranged with a solder paste 24 containing solder powder interposed therebetween, to a reduction atmosphere and reducing and removing an oxide film, a second step for heating the substrate 20 to the melting point of solder powder or higher, a third step for exposing the substrate 20 to a radical atmosphere and removing a reductant by decomposing with the radical, and a fourth step for lowering the temperature of the substrate 20 below the melting point of solder powder. |
