发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which composes a cascode circuit and which can sufficiently reduce resistance and inductance of the circuit.SOLUTION: A semiconductor device comprises a normally-off Si-MOSFET 2 and a normally-on GaN-MOSFET 3 sequentially stacked on a substrate 1. A source terminal 22 of the normally-on GaN-MOSFET 3 and a drain terminal 18 of the normally-off Si-MOSFET 2 are electrically connected with each other by a thin bump electrode 23 with sandwiching a solder layer 21 to compose a cascode connection circuit. Minimization of an electrical connection distance and maximization of an electrical connection cross section between the source terminal 22 of the normally-on GaN-MOSFET 3 and the drain terminal 18 of the normally-off Si-MOSFET 2 can be achieved by the thin bump electrode 23.
申请公布号 JP2013206942(A) 申请公布日期 2013.10.07
申请号 JP20120071443 申请日期 2012.03.27
申请人 SHARP CORP 发明人 ONO ATSUSHI
分类号 H01L25/065;H01L21/60;H01L23/52;H01L25/07;H01L25/18 主分类号 H01L25/065
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