发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE LAMINATE, FLEXIBLE CIRCUIT BOARD AND METHOD FOR FORMING PERMANENT PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent storage stability and good exposure sensitivity and suitable for forming a solder resist showing a higher reflectance.SOLUTION: The photosensitive resin composition comprises (A) an acid modified ethylenically unsaturated group-containing polyurethane resin, (B) a radical polymerizable compound, (C) a photopolymerization initiator, and (D) a hindered amine-based polymerization inhibitor. The (A) polyurethane resin includes a partial structure expressed by general formula (UE1). In the formula, Lrepresents a divalent linking group having neither -NHC(=O)O- nor -OC(=O)NH- in a bond of the main chain and having one ethylenically unsaturated group in a side chain.
申请公布号 JP2013205552(A) 申请公布日期 2013.10.07
申请号 JP20120073322 申请日期 2012.03.28
申请人 FUJIFILM CORP 发明人 KODAMA KEISUKE;AIKI YASUHIRO;HIRONAKA KOJI;ISOBE HIDEMI;MATSUSHITA YASUAKI;ISHIKAWA HIROYUKI
分类号 G03F7/027;C08F299/02;C08G18/67;G03F7/004;H05K3/28 主分类号 G03F7/027
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