发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE LAMINATE, FLEXIBLE CIRCUIT BOARD AND METHOD FOR FORMING PERMANENT PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent storage stability and good exposure sensitivity and suitable for forming a solder resist showing a higher reflectance.SOLUTION: The photosensitive resin composition comprises (A) an acid modified ethylenically unsaturated group-containing polyurethane resin, (B) a radical polymerizable compound, (C) a photopolymerization initiator, and (D) a hindered amine-based polymerization inhibitor. The (A) polyurethane resin includes a partial structure expressed by general formula (UE1). In the formula, Lrepresents a divalent linking group having neither -NHC(=O)O- nor -OC(=O)NH- in a bond of the main chain and having one ethylenically unsaturated group in a side chain. |
申请公布号 |
JP2013205552(A) |
申请公布日期 |
2013.10.07 |
申请号 |
JP20120073322 |
申请日期 |
2012.03.28 |
申请人 |
FUJIFILM CORP |
发明人 |
KODAMA KEISUKE;AIKI YASUHIRO;HIRONAKA KOJI;ISOBE HIDEMI;MATSUSHITA YASUAKI;ISHIKAWA HIROYUKI |
分类号 |
G03F7/027;C08F299/02;C08G18/67;G03F7/004;H05K3/28 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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