| 摘要 |
PROBLEM TO BE SOLVED: To provide a lid and a package for housing an optical semiconductor element which have high airtight reliability by restraining exfoliation and the like of a jointing material.SOLUTION: A lid 10 comprises: a plate-like frame body 1 having an opening 1a through which light passes from one surface to the other surface; a frame-like cushioning member 2 jointed to one surface of the frame body 1 to surround the opening 1a; and a window member 3 jointed to a face 2b opposite to a jointing face 2a of the cushioning member 2 to the frame body 1, and blocking the opening 1a. The cushioning member 2 has side faces inclined so that each of widths becomes gradually smaller from an intermediate section 2e between the jointing face 2a to the frame body 1 and the jointing face 2b to the window member 3 toward the jointing face 2a to the frame body 1 and the jointing face 2b to the window member 3. The side faces are gradually inclined toward both of the jointing faces so that thickness becomes thinner, so as to restrain a thermal stress between the cushioning member 2, the frame body 1 and the window member 3, and exfoliation and the like of a jointing material 4 due to the thermal stress. |
