| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module, which is capable of improving, in comparison with conventional techniques, shield performance of an electromagnetic shield for shielding electromagnetic noise and reliability of connection between the electromagnetic shield and wiring like a ground pattern, and manufacturing method of the electronic component module.SOLUTION: In an electronic component module 100, an electronic component 2 is mounted on a substrate 1, a mold resin 3 is provided to cover surfaces of the substrate 1 and the electronic component 2, and a conductive shield 51 is further formed to cover the mold resin 3. The conductive shield 51 includes a first filler and a second filler, which are different from each other, and is connected to grounding wiring 11 exposed through a side surface 12 of the substrate 1. An average particle diameter of the first filler is set equal to or less than a half of a thickness of the grounding wiring 11 and a material, which forms metal bonding in a temperature range of 250°C or lower, is used as the second filler. |
