| 摘要 |
PURPOSE: A probe device inspects all semiconductor devices formed on a semiconductor wafer by successively moving a probe card from a first position to a fourth position by a card moving mechanism. CONSTITUTION: A card clamp mechanism (13) detachably clamps a probe card (20) with multiple probes. A wafer chuck (10) brings an electrode formed on a semiconductor wafer (W) into contact with the probe of the probe card clamped to the card clamp mechanism. A housing (2) is disposed above the wafer chuck. A test head (30) is connected to a tester to inspect the condition of the semiconductor device. A card moving mechanism moves the probe card mounted on the card clamp mechanism and the test head in the horizontal direction. [Reference numerals] (40) Control unit; (41) Operation unit; (42) Memory unit |
