| 摘要 |
PROBLEM TO BE SOLVED: To certainly fix a semiconductor module with a simple configuration.SOLUTION: A fixation structure of a semiconductor module comprises: a first fitting part 11A provided on a mounting surface 2B of a heat sink 2 on which a semiconductor module 5 is to be mounted; and a second fitting part 22A provided on a presser bar spring 10 for pushing the semiconductor module 5. The first fitting part 11A includes a groove 12 and a claw part 13. The second fitting part 22A includes a curved part 31A which fits into the groove 12 and a locking piece 31 locked to the claw part 13. When the second fitting part 22A is fitted to the first fitting part 11A, transfer of the presser bar spring 10 is restricted and the semiconductor module 5 is pushed to the heat sing 2 by a base 21 and an arm part 23 of the presser bar spring 10. |
