| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element which prevents the increase of the work hours for making interlayer connection and enables easy formation of a lower surface electrode even when an aluminum substrate achieving high reflection rate and heat radiation performance is used as a base substrate.SOLUTION: A wiring board for mounting a light emitting element includes: an aluminum base; an upper substrate disposed on an upper surface of the aluminum base; a lower substrate disposed on a lower surface of the aluminum base; and a light emitting element mounting part provided at an opening of the upper substrate. The upper electrode provided on the upper substrate and the lower surface electrode provided on the lower substrate are electrically connected through the aluminum base to form an interlayer connection. |
