| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate manufacturing method capable of suppressing deterioration of adhesion strength.SOLUTION: A multilayer substrate manufacturing method comprises the steps of: preparing a plurality of resin films 12-14, 21-23 to form via holes 12c-14c, 21c-23c; charging conductive paste 40 from one faces 12b-14b, 21a-23a of the resin films 12-14, 21-23 into the via hols 12c-14c, 21c-23c; etching on faces 12b-14b, 21a-23a from which the conductive paste 40 is charged; removing organic solvent 40a of the conductive paste 40 adhering to the charged faces 12b-14b, 21a-23a, at the same time, applying a surface processing to form a cation exchange group on the charged faces; laminating the plurality of resin films 12-14, 21-23 so as to form a laminate; applying pressure to the laminate from a lamination direction while heating the same, so that the plurality of resin films 12-14, 21-23 are jointed to be a multilayer substrate. |
