| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of processing a substrate uniformly over the whole area in the plane.SOLUTION: The substrate processing apparatus includes a spin chuck 5 for rotating a substrate W about a vertical axis of rotation A1 while holding horizontally, a lower surface nozzle 8 for discharging process liquid toward the lower surface of the substrate W, and a chemical pipe 38 for supplying a process liquid of higher temperature than the lower surface nozzle 8 thereto. The lower surface nozzle 8 includes a plurality of discharge openings 29 arranged at a plurality of positions where the distance from the axis of rotation A1 is different from each other, and a passage 28 connected sequentially with the plurality of discharge openings 29 in the order from the outside to the inside. The process liquid supplied from the passage 28 to the plurality of discharge openings 29 is discharged therefrom toward the substrate W. |
