发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus which makes heat generated by electronic components mounted in a consolidated manner less likely to affect other electronic components and efficiently transmits the heat to a housing.SOLUTION: A circuit board 10 is fixed to a housing 20 by a boss 22 using a screw 30, and the boss 22 transmits heat generated by electronic components 11 to 14 from the circuit board 10 to the housing 20. Electronic component consolidated parts 15, 16, where the electronic components 11, 12 are mounted in a consolidated manner, are provided at an outer peripheral part of the circuit board 10. In a plane view, the boss 22 is positioned between the electronic components 11, 12 closest to the center side of the circuit board 10 in a direction that leads from the electronic component consolidated parts 15, 16 to the center of the circuit board 10.
申请公布号 JP2013207287(A) 申请公布日期 2013.10.07
申请号 JP20120078421 申请日期 2012.03.29
申请人 KEIHIN CORP 发明人 KUDO DAIKI;KOCHI HIDEAKI
分类号 H05K7/20;H05K1/02;H05K1/18;H05K7/14 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利