| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding apparatus and a grinding method, capable of easily grinding a workpiece pasted on a substrate to a predetermined thickness.SOLUTION: A grinding apparatus which grinds a workpiece of a workpiece unit including the workpiece, and a substrate having an area larger than the workpiece pasted with a bonding member includes a thickness detection means for detecting a thickness of the workpiece being ground. The thickness detecting means includes a first height position detector which abuts on an upper surface of a frame of a chuck table for detecting an upper surface height position of the frame, a second height position detector which abuts on an upper surface of the substrate of the workpiece unit held by the chuck table for detecting an upper surface height position of the substrate, a third height position detector which abuts on an upper surface of the workpiece ground by a grinding means, for detecting the upper surface height position of the workpiece. |
