| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for resist application capable of reducing a variation in the appearance of a resist pattern after development even if a wafer is warped.SOLUTION: The apparatus for resist application 100 comprises a bake heater 107b that heats the resist on a wafer and a control section 101 that controls the temperature distribution of the bake heater 107b when heating the resist. The control section 101 controls the temperature distribution of the bake heater 107b depending on the amount of the warpage of the wafer when heating the resist. |
