| 摘要 |
PROBLEM TO BE SOLVED: To bond a crystal oscillator hermetically and integrally with an IC chip, by shielding the crystal oscillator electromagnetically, without using a metal plate as the lid of a crystal package housing the crystal oscillator.SOLUTION: A lid 23 of a crystal package 2 housing the crystal oscillator 24 of a crystal oscillator 1 is composed only of an insulation material, e.g., a glass material or a quartz material, and the upper excitation electrode 24a of the crystal oscillator 24 is connected with the low impedance side, i.e., the output side, of the oscillation circuit of an IC chip 33. Consequently, electromagnetic shield effect is achieved for the outside, without sticking a metal plate to the lid 23 or without requiring deposition of a metal film. The crystal package 2 and an IC chip substrate 3 are bonded electrically and mechanically by a thermosetting resin added with solder particles. |
