发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MONITORING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device including a step of monitoring a state of a semiconductor manufacturing device by a monitoring device.SOLUTION: In a step of monitoring a state of a semiconductor manufacturing device by a monitoring device, n pieces of state monitor reference value data corresponding to each of n (1≤n) pieces of times is obtained by the monitoring device from a reference time during first operation time of the semiconductor manufacturing device. Each of n pieces of state monitor reference value data is added with a first tolerable value corresponding to each of n pieces of times, and the monitoring device acquires n pieces of upper limit tolerable value data. From each of n pieces of state monitor reference value data, a second tolerable value corresponding to each of n pieces of times is subtracted, and the monitoring device acquires n pieces of lower limit tolerable value data. Using n pieces of upper limit tolerable value data and n pieces of lower limit tolerable value data, state monitoring during second operation time of the semiconductor manufacturing device is performed by the monitoring device.
申请公布号 JP2013206915(A) 申请公布日期 2013.10.07
申请号 JP20120070898 申请日期 2012.03.27
申请人 SEIKO EPSON CORP 发明人 TAKEDA KENJI;FUKATO KOJI
分类号 H01L21/31;C23C16/52;H01L21/205;H01L21/3065 主分类号 H01L21/31
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