发明名称 HEAT-PEELABLE ADHESIVE SHEET FOR CUTTING ELECTRONIC COMPONENT, AND METHOD FOR PROCESSING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an energy ray-curable heat-peelable adhesive sheet, which secures sufficient adhesiveness between an energy ray-curable elastic layer and a base material after curing, and never causes partial peeling (anchor fracture) between the energy ray-curable elastic layer and the base material nor causes adhesive deposit on an adherend.SOLUTION: A heat-peelable adhesive sheet includes a heat-peelable adhesive layer 4 containing heat-expandable microspheres, which is provided on one surface of a base material 1. An energy ray-curable elastic layer 3 is disposed on the other surface of the base material through an organic coating layer 2.
申请公布号 JP2013203800(A) 申请公布日期 2013.10.07
申请号 JP20120071957 申请日期 2012.03.27
申请人 NITTO DENKO CORP 发明人 HIRAYAMA TAKAMASA;SHIMOKAWA DAISUKE;ARIMITSU YUKIO
分类号 C09J7/02;B32B27/00 主分类号 C09J7/02
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