METHOD FOR PROCESSING OPTICAL DEVICE WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for processing an optical device wafer capable of uniformly breaking a buffer layer and surely peeling an epitaxial substrate.SOLUTION: A method for processing an optical device wafer transfers an optical device layer of an optical device wafer laminated on a surface of an epitaxial substrate via a buffer layer and an optical device layer of an optical device wafer bonded to a transfer substrate via a bonding metal layer to the transfer substrate. This method includes the steps of: performing diffusion processing for diffusing a laser beam to a rear surface of the epitaxial substrate; breaking the buffer layer by irradiating the buffer layer with a pulse laser beam of a wavelength having permeability to the epitaxial substrate or having absorptivity to the buffer layer from a rear surface side of the diffused epitaxial substrate; and peeling the epitaxial substrate from the optical device layer and transferring the optical device layer to the transfer substrate after performing the buffer layer breaking step.